Uso de sustituto dérmico en niños con secuelas de quemaduras: Tres casos clínicos

QUEZADA K, M. BEATRIZ; AYALA M, RICARDO; YÁÑEZ V, VERÓNICA

Keywords: ambulatory surgery, cirugía ambulatoria, integra®, secuela de quemadura, pediatric patient, burn sequelae, paciente pediátrico, sustituto dérmico-integra®

Abstract

"Background: In COANIQUEM, burn sequelae ambulatory reconstructive surgeries in pediatric patients are performed during their rehabilitation treatments. One of these surgeries is the traditional technique of postburn contracture reléase and split-thickness skin grafting. A new alternative has been the appearance of a dermis substitute (Integra, Dermal Regeneration Témplate). There is no previous experience in Chile with this artificial skin applied in children with burn sequelae. Objective: Evalúate the ambulatory utilization of this dermis substitute in pediatric patients with burn sequelae and their evolution during two years. Case-reports: Surgeries carried out during 2004 in three patients 9 to 13 years-old, with upper extremity esthetic - functional sequelae. 24 months after surgery, a life- quality test (BSHS) and a rehabilitation protocol were applied. Results: There were no surgical complications in the three patients; the grafting attachment percentage varied between 75 and 100%. All of them needed compression therapy for 13 months. The elasticity and folding were similar to normal skin two years after evolution, with absence of fibrosis and graft contraction. BSHS was favourable. One case presented mild infection. Conclusión: Dermis cutaneous substitute Integra constitutes a good treatment alternative and its ambulatory use is possible without surgical complications."

Más información

Título según SCIELO: Uso de sustituto dérmico en niños con secuelas de quemaduras: Tres casos clínicos
Título de la Revista: REVISTA CHILENA DE PEDIATRIA
Volumen: 80
Número: 2
Editorial: Sociedad Chilena de Pediatría
Fecha de publicación: 2009
Página de inicio: 150
Página final: 156
Idioma: es
URL: http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0370-41062009000200007&lng=en&nrm=iso&tlng=en
DOI:

10.4067/S0370-41062009000200007

Notas: SCIELO