Energy assessment of wood-frame vertical envelope solutions applied in educational establishments of southern Chile

Piggot J.; Piderit M.B.; Blanchet P.

Abstract

The objective of this research is to analyze the thermal performance of wood-frame vertical envelope solutions used in Canadian establishments and to evaluate how these technologies contribute towards reducing the energy demand of educational establishments in Chile. The first stage of the research involved reviewing the wood-frame envelope solutions used in Canada. Six solutions were selected in order to evaluate their thermal performance and the energy demand reduction produced when they are incorporated in Chilean educational establishment envelopes. To improve the accuracy of the energy demand results, the linear thermal transmittance values (psi) were obtained for each of the wall solution joints with the rest of the envelope's elements, using LBNL Therm. Finally, using Design Builder, energy simulations were developed incorporating all the values (psi) obtained before, in order to evaluate the demand reduction produced by the selected solutions. The results indicate that the solutions analyzed save up to 51% of the heating demand of the establishments during the coldest months. This allows promoting the use of wood as a sustainable material which aligns with the "Energy 2050" policy.

Más información

Título según WOS: Energy assessment of wood-frame vertical envelope solutions applied in educational establishments of southern Chile
Título según SCOPUS: Energy assessment of wood-frame vertical envelope solutions applied in educational establishments of southern Chile
Título según SCIELO: Energy assessment of wood-frame vertical envelope solutions applied in educational establishments of southern Chile
Título de la Revista: REVISTA DE LA CONSTRUCCION
Volumen: 18
Número: 1
Editorial: PONTIFICIA UNIV CATOLICA CHILE, ESCUELA CONSTRUCCION CIVIL
Fecha de publicación: 2019
Página de inicio: 201
Página final: 213
Idioma: English
DOI:

10.7764/RDLC.18.1.201

Notas: ISI, SCIELO, SCOPUS