Submicron copper-low-density polyethylene conducting composites: Structural electrical, and percolation threshold

Alvarez, MP; Poblete, VH; Pilleux, ME; Fuenzalida, VM

Abstract

Copper-embedded low-density polyethylene (LDPE) composites were fabricated using different copper concentrations in the polymer matrix. The copper particles were spherical with a mean particle size between 200 and 300 nm. All the samples were compacted under pressure and melted. The LDPE matrix was analyzed using gel permeation chromatography (GPC) and it did not evidence degradation of the LDPE matrix. The microstructure of the composites was examined with scanning electron microscopy. The electrical conductivity was measured as a function of the copper content, and the composite fabricated with a 10 vol % copper presented a conductivity 15 orders of magnitude higher than that of pure LDPE. The enhancement in conductivity can be explained by means of segregated percolation path theory and the experimental results are in agreement with the theoretical law. © 2006 Wiley Periodicals, Inc.

Más información

Título según WOS: Submicron copper-low-density polyethylene conducting composites: Structural electrical, and percolation threshold
Título según SCOPUS: Submicron copper-low-density polyethylene conducting composites: Structural, electrical, and percolation threshold
Título de la Revista: JOURNAL OF APPLIED POLYMER SCIENCE
Volumen: 99
Número: 6
Editorial: Wiley
Fecha de publicación: 2006
Página de inicio: 3005
Página final: 3008
Idioma: English
URL: http://doi.wiley.com/10.1002/app.23013
DOI:

10.1002/app.23013

Notas: ISI, SCOPUS