Improvement of superelasticity conditions in Cu-based shape memory alloys for seismic control applications
Abstract
Shape memory alloys (SMAs) are smart materials with self-centering characteristics that can be used to reduce the earthquake damage to structures. In this paper, the optimal thermal treatment to obtain the ideal mechanical properties of a CuAlBe SMA wires for seismic protection applications is discussed. For this purpose, the uniaxial cyclic and monotonic stress-strain response of a 1.4 mm-diameter wire subjected to heat treatments applied for different durations is evaluated. Wire specimens are tested in multiple environments at several strain amplitudes and loading protocols. The variation of mechanical properties over time is also addressed. Test results show that a minimum treatment time of 25 min at 750 °C (â¼200 μm) is necessary for obtaining superelasticity at all ambient temperatures tested. Also, as the heat treatment time increases, the residual strain, functional fatigue, strength, energy dissipation and hysteresis degradation decrease, but the superelasticity limit and low cycle fatigue life are increased. However, a 35 min treatment (â¼400 μm) causes the loops to become unstable at high temperatures and the training process is not efficient. The best conditions for seismic protection purposes are achieved with a 30 min treatment (â¼300 μm), due to its maximum recoverable strain of 6.5 %, 3.6 % equivalent viscous damping, negligible residual strain and stable hysteresis under all temperatures evaluated and over time. A low-cycle fatigue model based on the Coffin - Manson relationship is also proposed.
Más información
| Título según WOS: | Improvement of superelasticity conditions in Cu-based shape memory alloys for seismic control applications |
| Título según SCOPUS: | Improvement of superelasticity conditions in Cu-based shape memory alloys for seismic control applications |
| Título de la Revista: | Engineering Structures |
| Volumen: | 274 |
| Editorial: | Elsevier Ltd. |
| Fecha de publicación: | 2023 |
| Idioma: | English |
| DOI: |
10.1016/j.engstruct.2022.115151 |
| Notas: | ISI, SCOPUS |