High-Frequency Parametric Study of Electroplated Conductive Filaments in 3D Printed Microwave Topologies
Abstract
This article presents a high-frequency characterization from 1 up to 10 GHz of electroplated conductive filaments in 3D printed microwave topologies. This study implements different microstrip lines and antennas to compare their performance as-is and with the electroplating process. The results for the microstrip lines show a significant decrease in losses for the electroplated devices, even reaching loss levels of pure copper devices. In addition, considerations about the required thickness for the conductor are analyzed by considering the skin depth requirement for nonideal conductors. The results for a patch antenna measurement confirm that the antenna height can be reduced to extremely low levels.
Más información
Título según WOS: | ID WOS:001138108400001 Not found in local WOS DB |
Título según SCOPUS: | ID SCOPUS_ID:85176429970 Not found in local SCOPUS DB |
Título de la Revista: | 3D PRINTING AND ADDITIVE MANUFACTURING |
Fecha de publicación: | 2023 |
DOI: |
10.1089/3DP.2023.0074 |
Notas: | ISI, SCOPUS |