Integration of Cyber-Physical System and Digital Twin for Controlling a Robotic Manipulator: An Industry 4.0 Approach

Loyola O.; Suarez B.; Sandoval C.; Carriillo, E

Keywords: robots, Industry 4.0, cyber-physical systems, Robot Internet of Things

Abstract

This paper considers the integration and application of a Cyber-Physical System (CPS) and a digital twin to control a three-degree-of-freedom (3DoF) robotic manipulator. Here, framed in Industry 4.0, we consider robots as interconnected components within a broader network. Supported by current literature, we contribute to advancing interlinked systems that mirror the physical dynamics of equipment and facilitate their remote visualization–a cornerstone in the architecture of Internet of Things (IoT) robotics. Our strategy is rooted in three core stages: modeling, simulation, and implementation, and aims to seam-lessly integrate the constituent elements of a robotic agent within an Internet of Robotic Things (IoRT) environment. At this nascent stage, the system has undergone testing at the prototype level, with ambitions to scale it for deployment in industrial settings. Preliminary results demonstrate the efficacy of the system in simulating and controlling the robotic manipulator, highlighting the potential of this integrated approach in practical applications. Our findings are pivotal to these concepts’ evolution and roll-out, bolstering understanding of the nexus between CPS, digital twins, and robotics within Industry 4.0.

Más información

Título según WOS: Integration of Cyber-Physical System and Digital Twin for Controlling a Robotic Manipulator: An Industry 4.0 Approach
Título según SCOPUS: Integration of Cyber-Physical System and Digital Twin for Controlling a Robotic Manipulator: An Industry 4.0 Approach
Título de la Revista: Communications in Computer and Information Science
Volumen: 1924
Editorial: Springer Science and Business Media Deutschland GmbH
Fecha de publicación: 2024
Página final: 152
Idioma: English
DOI:

10.1007/978-3-031-47372-2_14

Notas: ISI, SCOPUS