Agglomeration and leaching of copper tailings in a fixed bed for laboratory scale: Effect of the moisture in the agglomeration Aglomeración y lixiviación en lecho fijo de colas de proceso de flotación de cobre a escala de laboratorio: Efecto del contenido de humedad en la aglomeración

Herrera C.A.; Muñoz J.F.; Casas J.M.

Keywords: copper, acid, metal, hydrodynamics, moisture, recovery, leaching, hydrometallurgy, tailings, agglomeration, properties, solution, Hydrodispersive

Abstract

In this work the effect of moisture on the agglomeration of copper tailing material which could be processed by leaching in heaps in order to recover valuable metals, is evaluated. The efficiency of leaching performed in columns at laboratory scale was quantified as a function of moisture content in prepared agglomerates. Main hydrometallurgical variables, hydrodynamics, and hydrodispersive properties of agglomerates were obtained. Results indicate that samples agglomerated with a moisture close to 10% exhibited the best copper recovery in the shortest time and presented the higher ore bed hydrodynamic properties for the flux of acid solution. The main conclusion is that moisture content is the key process variable, which shows an important effect on the efficiency of both the agglomeration and the leaching stages. Therefore, a careful control of this variable must be taking into account during the hydrometallurgical processing of copper tailings.

Más información

Título según SCOPUS: Agglomeration and leaching of copper tailings in a fixed bed for laboratory scale: Effect of the moisture in the agglomeration [Aglomeración y lixiviación en lecho fijo de colas de proceso de flotación de cobre a escala de laboratorio: Efecto del contenido de humedad en la aglomeración]
Título de la Revista: REVISTA DE METALURGIA
Volumen: 39
Número: 5
Editorial: CONSEJO SUPERIOR INVESTIGACIONES CIENTIFICAS-CSIC
Fecha de publicación: 2003
Página de inicio: 330
Página final: 345
Idioma: Spanish
URL: http://www.scopus.com/inward/record.url?eid=2-s2.0-0346280215&partnerID=q2rCbXpz
Notas: SCOPUS