Optimization of processing parameters for the synthesis of low-density polyethylene/organically modified montmorillonite nanocomposites using X-ray diffraction with experimental design

Campos-Requena, VH; Rivas BL; Perez, MA; Contreras D.; Muñoz E

Abstract

The influence of the processing parameters on the synthesis of low-density polyethylene (LDPE)/organically modified montmorillonite (OMM) nanocomposite films was studied using experimental design. Intercalation in the nanocomposites was analysed using X-ray diffraction and verified using atomic force microscopy. Four direct melt processing parameters were studied to obtain surface maps of intercalation in the nanocomposites: concentration of OMM (clay-%), concentration of Polybond (R) 3149 (compatibilizer-%), mixing temperature (Tmix) and mixing time. An ANOVA validated the polynomial function, and intercalation maps from response surface methodology (RSM) were obtained. The clay-% parameter had the most significant effect, and Tmix showed no significant effect on intercalation (p<0.05). A strong synergic interaction between clay-% and compatibilizer-% was observed, which is not possible to detect using univariate experiments. RSM provides a powerful tool for choosing the best processing conditions that lead to formulations with the highest intercalations by considering the main factors and their interactions. (c) 2013 Society of Chemical Industry

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Título según WOS: Optimization of processing parameters for the synthesis of low-density polyethylene/organically modified montmorillonite nanocomposites using X-ray diffraction with experimental design
Título según SCOPUS: Optimization of processing parameters for the synthesis of low-density polyethylene/organically modified montmorillonite nanocomposites using X-ray diffraction with experimental design
Título de la Revista: POLYMER INTERNATIONAL
Volumen: 62
Número: 4
Editorial: Wiley
Fecha de publicación: 2013
Página de inicio: 548
Página final: 553
Idioma: English
URL: http://doi.wiley.com/10.1002/pi.4465
DOI:

10.1002/pi.4465

Notas: ISI, SCOPUS