Abstract

Objectives: To evaluate the effect of an additional hydrophobic resin coating (HE) on the resin-dentine microtensile bond strengths (mu TBS), nanoleakage (NL), and in situ degree of conversion (DC) of three universal adhesives used in the etch-and-rinse (ER) and the self-etch (SE) modes. Methods: Sixty caries-free extracted third molars were divided into 12 groups according to the combination of the factors adhesive (All-Bond Universal [ABU]; G-Bond Plus [GBP] and Scotchbond Universal [SBU]), adhesive strategy (ER and SE), and the use of HE (Heliobond; yes or no). After restorations were constructed, specimens were stored in water (37 degrees C/24 h) and sectioned into resin-dentine beams (0.8 mm(2)) to be tested under tension (0.5 mm/min). Selected beams from each tooth were used for DC quantification and for NL evaluation. Data from each adhesive were analyzed with two-way ANOVA and Tukey's test (alpha = 0.05). Results: ABU and GBP resulted in higher mu TBS in the ER mode. The use of HE increased the mu TBS of ABU and GBP only in the SE mode. Lower NL was observed for SBU and ABU in the ER mode + HE, and for GBP in the SE mode + HE. SBU and GBP showed higher DC when used in the ER mode, which was increased with HE application. The DC of ABU was similar in all conditions. Conclusions: The conversion of 1-step SE to 2-step SE may increase the mTBS and DC of current universal adhesives. The reduction in the NL is more dependent on the adhesive composition than on the bonding strategy. (C) 2014 Elsevier Ltd. All rights reserved.