Influence of the thermal annealing on the electrical resistivity and thermal diffusivity of Pd:Ag nanocomposites

C.A.S Lima; R Oliva; G Cardenas T; E.N Silva; L.C.M Miranda

Keywords: metal colloids, thermal diffusivity, nano-composites, thermal annealing, electrical resistivity, porous materials

Abstract

In this paper, we report on the influence of thermal annealing on the electrical and thermal properties of nano-clustered Pd:Ag particles packed into compressed thin wafers. The nano-crystalline Pd:Ag compacts were prepared by solvent evaporation of non-aqueous metal colloids prepared by clustering of metal atoms in organic solvents at low temperature. Samples of Pd:Ag nano-clustered powder so obtained were then compressed into roughly 250 μm thick, 10 mm diameter wafers, and annealed at different temperatures, for about 1 h. The dependence of the electrical resistivity and of the thermal diffusivity of the resulting compacts on their corresponding annealing temperatures were investigated using a LCR impedance meter and a photoacoustic thermal diffusivity measurement apparatus.

Más información

Título de la Revista: MATERIALS LETTERS
Volumen: 51
Número: 4
Editorial: Elsevier
Fecha de publicación: 2001
Página de inicio: 357
Página final: 362
DOI:

https://doi.org/10.1016/S0167-577X(01)00321-4

Notas: ISI, https://doi.org/10.1016/S0167-577X(01)00321-4