Abstract

A Bond-Wire Antenna (BWA) array has been designed to provide indoor coverage at high frequencies (60 GHz) for the next generation high bandwidth wireless networks. The new antenna combines relatively high radiation efficiency with excellent integration possibilities. It does not require an extra transmission line between the front-end and antenna and furthermore, the BWA can be manufactured using existing technologies that are already available to chip manufacturers, which is a tremendous benefit. The main innovation is the idea of using multiple loops of very thin gold wires to manufacture an antenna of minimal dimensions with an optimal radiation patter for short range (single room) coverage.