Electrodeposition of Cu-Re alloy thin films

Schrebler, R; Merino, M; Cury P.; Romo, M; CORDOVA, R; Gómez H.; Dalchiele, EA

Abstract

The electrodeposition of copper-rhenium alloys from Cu(II) and Re(IV) solutions was studied in an aqueous H2SO4 matrix. Different substrates have been used (glassy carbon, titanium and gold), and the effect of them on the electrochemical behavior of the studied ions is shown. Cyclic voltammetry was used in conjunction with oscillating quartz crystal nanogravimetry to delineate features in the voltammograms accompanied by mass loss or gain at the electrode surface, from those attributable to the solution phase. The obtained Cu-Re films were subjected to scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffraction analysis (XRD). The rhenium content increases as the potential was made more cathodic, reaching a maximum value of 10% atomic composition. The films were amorphous with a cauliflower structure. © 2001 Published by Elsevier Science B.V.

Más información

Título según WOS: Electrodeposition of Cu-Re alloy thin films
Título según SCOPUS: Electrodeposition of Cu-Re alloy thin films
Título de la Revista: THIN SOLID FILMS
Volumen: 388
Número: 01-feb
Editorial: Elsevier
Fecha de publicación: 2001
Página de inicio: 201
Página final: 207
Idioma: English
URL: http://linkinghub.elsevier.com/retrieve/pii/S0040609001008501
DOI:

10.1016/S0040-6090(01)00850-1

Notas: ISI, SCOPUS