C-Au Covalently Bonded Molecular Junctions Using Nonprotected Alkynyl Anchoring Groups

Olavarria-Contreras, Ignacio Jose; Perrin, Mickael L.; Chen, Zhi; Klyatskaya, Svetlana; Ruben, Mario; van der Zant, Herre S. J.

Abstract

We report on an approach to realize carbon-gold (C-Au) bonded molecular junctions without the need for an additive to deprotect the alkynyl carbon as endstanding anchor group. Using the mechanically controlled break junction (MCBJ) technique, we determine the most probable conductance value of a family of alkynyl terminated oligophenylenes (OPA(n)) connected to gold electrodes through such an akynyl moiety in ambient conditions. The molecules bind to the gold leads through an sp-hybridized carbon atom at each side. Comparing our results with other families of molecules that present organometallic C-Au bonds, we conclude that the conductance of molecules contacted via an sp-hybridized carbon atom is lower than the ones using spa hybridization due to strong differences in the coupling of the conducting orbitals with the gold leads.

Más información

Título según WOS: ID WOS:000379794400029 Not found in local WOS DB
Título de la Revista: JOURNAL OF THE AMERICAN CHEMICAL SOCIETY
Volumen: 138
Número: 27
Editorial: AMER CHEMICAL SOC
Fecha de publicación: 2016
Página de inicio: 8465
Página final: 8469
DOI:

10.1021/jacs.6b03383

Notas: ISI