Article ISI SCOPUS
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES  (2019)

The sonic application of universal adhesives in self-etch mode improves for their performance on enamel

Munoz, MA; Luque-Martinez, I; Hass, V; Gutierrez, MF; Reis, A; Loguercio, AD

Keywords: enamel, Etch-and-rinse, Self-etch, Degree of conversion, Microshear bond strength, Universal adhesive systems, Sonic application

Más información

Título según WOS: The sonic application of universal adhesives in self-etch mode improves for their performance on enamel
Título según SCOPUS: The sonic application of universal adhesives in self-etch mode improves their performance on enamel
Título de la Revista: INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volumen: 88
Editorial: ELSEVIER SCI LTD
Fecha de publicación: 2019
Página de inicio: 43
Página final: 49
Idioma: English
DOI:

10.1016/j.ijadhadh.2018.10.013
Notas: ISI, SCOPUS