ConferencePaper SCOPUS
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019  (2019)

Electrorepulsion in nanofluids: Experimental characterization for a stable behavior

Chen, D.; Vasco D.A.; Di Capua M.H.; Guzmán A.M.

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Título según SCOPUS: Electrorepulsion in nanofluids: Experimental characterization for a stable behavior
Título de la Revista: ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
Editorial: American Society of Mechanical Engineers (ASME)
Fecha de publicación: 2019
Idioma: English
DOI:

10.1115/MNHMT2019-3980
Notas: SCOPUS