ConferencePaper SCOPUS
TEI 2020 - Proceedings of the 14th International Conference on Tangible, Embedded, and Embodied Interaction  (2020)

Design of a curriculum analytics tool to support continuous improvement processes in higher education

Hilliger I.; Aguirre C.; Miranda C.; Celis S.; Pérez-Sanagustín M.

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Título según SCOPUS: Design of a curriculum analytics tool to support continuous improvement processes in higher education
Título de la Revista: TEI 2020 - Proceedings of the 14th International Conference on Tangible, Embedded, and Embodied Interaction
Editorial: Association for Computing Machinery, Inc
Fecha de publicación: 2020
Página de inicio: 181
Página final: 186
Idioma: English
DOI:

10.1145/3375462.3375489
Notas: SCOPUS