Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails
Abstract
The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits.
Más información
| Título según WOS: | ID WOS:000273566500011 Not found in local WOS DB |
| Título de la Revista: | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS |
| Volumen: | 20 |
| Número: | 1 |
| Editorial: | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| Fecha de publicación: | 2010 |
| Página de inicio: | 31 |
| Página final: | 33 |
| DOI: |
10.1109/LMWC.2009.2035960 |
| Notas: | ISI |