Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

Rajo-Iglesias, Eva; Zaman, Ashraf Uz; Kildal, Per-Simon

Abstract

The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits.

Más información

Título según WOS: ID WOS:000273566500011 Not found in local WOS DB
Título de la Revista: IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volumen: 20
Número: 1
Editorial: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Fecha de publicación: 2010
Página de inicio: 31
Página final: 33
DOI:

10.1109/LMWC.2009.2035960

Notas: ISI