Thermal Study of a Modular Multilevel Converter Submodule

Dujic, Drazen

Keywords: modular multilevel converter, Submodule, thermal characterization

Abstract

Modular multilevel converters are gaining attention since medium voltage direct current grids have been proposed as the new key technology for future transmission and distribution systems. The design of such systems need to address several challenges, and this paper presents a thermal study of a modular multilevel converter full-bridge IGBT-based submodule. Thorough tests have been performed under severe ambient thermal conditions and electrical stresses, typical to regular modular multilevel converter operation. Presented results demonstrate an excellent match between theoretically predicted numbers and those obtained in a custom-designed experimental test setup.

Más información

Editorial: VDE
Fecha de publicación: 2020
Año de Inicio/Término: 7-8 July 2020
Página de inicio: 1
Página final: 8
Idioma: English
URL: https://ieeexplore.ieee.org/document/9178137