Measuring out-of-plane displacements by electronic speckle-pattern interferometry (ESPI) and whole-field subtractive moire

Cordero, RR; Labbe, F.

Abstract

By using both electronic speckle-pattern interferometry (ESPI) and whole-field subtractive moiré, we followed the changes in the topography of 1100 aluminium sheet samples subjected to uniaxial tensile tests. We compare the performance of both techniques and discuss their advantages and limitations. We observed that, during the transition zone to the stage of plastic deformation of the test, the sheet metal specimens were thinned mainly along a relatively broad inclined band that exhibited a remarkable degree of localization. © 2006 IOP Publishing Ltd.

Más información

Título según WOS: Measuring out-of-plane displacements by electronic speckle-pattern interferometry (ESPI) and whole-field subtractive moire
Título según SCOPUS: Measuring out-of-plane displacements by electronic speckle-pattern interferometry (ESPI) and whole-field subtractive moiré
Título de la Revista: MEASUREMENT SCIENCE AND TECHNOLOGY
Volumen: 17
Número: 4
Editorial: IOP PUBLISHING LTD
Fecha de publicación: 2006
Página de inicio: 825
Página final: 830
Idioma: English
URL: http://stacks.iop.org/0957-0233/17/i=4/a=029?key=crossref.541b5140ed6e19336c6633670200afff
DOI:

10.1088/0957-0233/17/4/029

Notas: ISI, SCOPUS