Cyber-Attacks in Modular Multilevel Converters

Burgos-Mellado, Claudio; Donoso, Felipe; Dragicevic, Tomislav; Cardenas-Dobson, Roberto; Wheeler, Patrick; Clare, Jon; Watson, Alan

Abstract

Distributed control of modular multilevel converter (MMC) submodules (SMs) offers several potential benefits such as flexibility, scalability, and modularity. In this approach, low-level control tasks, such as capacitor voltage balancing, can be distributed amongst controllers placed in the SMs. This decreases the computational burden for the central control system that performs high-level control tasks; also, a single point of failure is avoided. Distributed control architecture requires a cyber-physical network (CFN) through which local controllers share all the information necessary to perform their respective control loops. To date, none of the reported works in this field have paid attention to potential imperfections in the CFN. Indeed, previous works are based on the assumption that the network always provides correct information to the local controllers. However, erroneous measurements in the CFN may degrade the distributed control scheme operation, leading to suboptimal or even unstable operation. These events can occur in the presence of cyberattacks, for example, which can be created through illegitimate data intrusion into the distributed control architectures. This article is the first to investigate the impacts of cyberattacks on distributed control schemes used in MMCs. The effects of a specific cyberattack, named false data injection attack (FDIA), on a consensus-based distributed control strategy are studied in this article. Additionally, a method for detecting FDIAs is proposed, along with a countermeasure strategy, to ensure the safe operation of the MMC, while the attack is cleared. The proposals reported in this article are validated using simulation and experimental results.

Más información

Título según WOS: ID WOS:000773301800084 Not found in local WOS DB
Título de la Revista: IEEE TRANSACTIONS ON POWER ELECTRONICS
Volumen: 37
Número: 7
Editorial: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Fecha de publicación: 2022
Página de inicio: 8488
Página final: 8501
DOI:

10.1109/TPEL.2022.3147466

Notas: ISI