Design of Fe36.29Cr28.9Ni26.15Cu4.17Ti1.67V2.48C0.46 HEA using a new criterion based on VEC: Microstructural study and multiscale mechanical response

Onate, A.; Sanhueza, J. P.; Ramirez, J.; Medina, C.; Melendrez, M. F.; Rojas, D.

Abstract

The present work updated empirical parameter ranges with a high adjustment to the experimental results as obtained by the means of the exploratory data analysis (EDA) method. A new high entropy alloy with FCC structure reinforced by precipitation of intermetallic phases fabricated by vacuum-argon induction melting was designed and modeled. The main results showed that the valence electron concentration (VEC) is the predom-inant empirical phase prediction parameter in high entropy alloys and that the lattice packing factor is necessary to determine the presence of intermetallic phases effectively. Phase stability ranges based on VEC associated with the base crystal structures and the presence of intermetallics corroborated computationally by CALPHAD and experimentally were reported. The interdendritic zone proved to be a preferential precipitation zone with pre-cipitates of sigma, TiC, and gamma' phases. The gamma' phase showed a size difference between the dendritic and interdendritic zone associated with diffusive Ti mechanisms. The nanoscale mechanical response determined that dislocation creep and reinforcement in the interdendritic zone are predominant creep mechanisms that obtained an effective entanglement of the dislocations increasing the strain hardening coefficient. The mechanical response of the alloy obtained is superior to the average of the alloys with FCC structure. It maintains a high ductility that allows reaching an energy absorption and damage tolerance of 43.56 GPa% showing severe plastic slip lines being in the range of use for aerospace applications and hydrogen tanks.

Más información

Título según WOS: ID WOS:001010750700001 Not found in local WOS DB
Título de la Revista: MATERIALS TODAY COMMUNICATIONS
Volumen: 35
Editorial: Elsevier
Fecha de publicación: 2023
DOI:

10.1016/j.mtcomm.2023.105681

Notas: ISI