Liposomes Loaded with Green Tea Polyphenols-Optimization, Characterization, and Release Kinetics Under Conventional Heating and Pulsed Electric Fields
Abstract
This study aimed to increase the encapsulation efficiency (EE%) of liposomes loaded with green tea polyphenols (GTP), by optimizing with response surface methodology (RSM), characterizing the obtained particles, and modeling their release under conventional heating and pulsed electric fields. GTP-loaded liposomes were prepared under conditions of Lecithin/Tween 80 (4:1, 1:1, and 1:4), cholesterol (0, 30, and 50%), and chitosan as coating (0, 0.05, and 0.1%). Particles were characterized by size, polydispersity index, zeta-potential, electrical conductivity, and optical microscopy. The release kinetics was modeled at a temperature of 60 degrees C and an electric field of 5.88 kV/cm. The optimal manufacturing conditions of GTP liposomes (ratio of lecithin/Tween 80 of 1:1, cholesterol 50%, and chitosan 0.1%) showed an EE% of 60.89% with a particle diameter of 513.75 nm, polydispersity index of 0.21, zeta-potential of 33.67 mV, and electrical conductivity of 0.14 mS/cm. Optical microscopy verified layering in the liposomes. The kinetic study revealed that the samples with chitosan were more stable to conventional heating, and those with higher cholesterol content were more stable to pulsed electric fields. However, in both treatments, the model with the best fit was the Peppas model. The results of the study allow us to give an indication of the knowledge of the behavior of liposomes under conditions of thermal and non-thermal treatments, helping the development of new functional ingredients based on liposomes for processed foods.
Más información
Título según WOS: | Liposomes Loaded with Green Tea Polyphenols-Optimization, Characterization, and Release Kinetics Under Conventional Heating and Pulsed Electric Fields |
Título según SCOPUS: | ID SCOPUS_ID:85161400155 Not found in local SCOPUS DB |
Título de la Revista: | FOOD AND BIOPROCESS TECHNOLOGY |
Editorial: | Springer |
Fecha de publicación: | 2023 |
DOI: |
10.1007/S11947-023-03136-8 |
Notas: | ISI, SCOPUS |