An Experience in Learning Outcomes Assessment in Software Engineering Using Belbin Roles, Lego Serious Play and Multimodal Learning Analytics

Cornide-Reyes, Hector; Muñoz, Guisselle; Monsalves, Diego; Riquelme, Fabián

Abstract

Nowadays, the vast majority of university careers declare a competency-based curriculum. However, having concrete evidence to measure learning outcomes can be a complex problem in engineering. Academics make great efforts to design active learning experiences to stimulate skills development. However, more evidence is required to describe methodologies integrated with technological tools to evaluate learning outcomes. In this paper, we propose using the Lego Serious Play (LSP) methodology and Multimodal Learning Analytics (MMLA) techniques to assess learning outcomes in the Software Engineering I course. The results obtained are quite promising since it was possible to identify difficulties in acquiring and applying knowledge.

Más información

Título de la Revista: 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON)
Editorial: IEEE
Fecha de publicación: 2023
Año de Inicio/Término: diciembre 2023
Idioma: inglés
URL: https://ieeexplore.ieee.org/abstract/document/10418720