EFFECT OF THIOUREA CONCENTRATION ON THE ELECTROCHEMICAL BEHAVIOR OF GOLD AND COPPER ELECTRODES IN PRESENCE AND ABSENCE OF Cu(II) IONS

Gómez H.; Lizama, H; Suarez C.; Valenzuela A.

Abstract

The effect of thiourea (TU) concentration on copper electrodeposition was studied employing cyclic voltammetry and electrochemical crystal quartz microbalance techniques. It was found that the polarization effects are related to the type of species generated in the electrode interface. Due to formation of formamidine disulfide (FDS) at concentrations greater than 10-4 mol dm-3, the electrode surface is blocked, and copper electrodeposition shifts towards more negative potential values (polarizing effect). Lower concentrations favors the formation of Cu(I) -TU contributing to the de-polarization of copper electrodeposition reaction.

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Título según WOS: EFFECT OF THIOUREA CONCENTRATION ON THE ELECTROCHEMICAL BEHAVIOR OF GOLD AND COPPER ELECTRODES IN PRESENCE AND ABSENCE OF Cu(II) IONS
Título según SCOPUS: Effect of thiourea concentration on the electrochemical behavior of gold and copper electrodes in presence and absence of Cu(II) ions.
Título según SCIELO: EFFECT OF THIOUREA CONCENTRATION ON THE ELECTROCHEMICAL BEHAVIOR OF GOLD AND COPPER ELECTRODES IN PRESENCE AND ABSENCE OF Cu(II) IONS
Título de la Revista: JOURNAL OF THE CHILEAN CHEMICAL SOCIETY
Volumen: 54
Número: 4
Editorial: 2013
Fecha de publicación: 2009
Página de inicio: 439
Página final: 444
Idioma: English
DOI:

10.4067/S0717-97072009000400026

Notas: ISI, SCIELO, SCOPUS