Characterization and Modeling of 22 nm FDSOI Cryogenic RF CMOS

Chakraborty, Wriddhi; Aabrar, Khandker Akif; Gomez, Jorge; Saligram, Rakshith; Raychowdhury, Arijit; Fay, Patrick; Datta, Suman

Abstract

Analog and RF mixed-signal cryogenic-CMOS circuits with ultrahigh gain-bandwidth product can address a range of applications such as interface circuits between superconducting (SC) single-flux quantum (SFQ) logic and cryo-dynamic random-access memory (DRAM), circuits for sensing and controlling qubits faster than their decoherence time for at-scale quantum processor. In this work, we evaluate RF performance of 18 nm gate length (L-G) fully depleted silicon-on-insulator (FDSOI) NMOS and PMOS from 300 to 5.5 K operating temperature. We experimentally demonstrate extrapolated peak unity current-gain cutoff frequency (f(T)) of 495/337 GHz (1.35x/1.25x gain over 300 K) and peak maximum oscillation frequency (f(MAX)) of 497/372 GHz (1.3x gain) for NMOS/PMOS, respectively, at 5.5 K. A small-signal equivalent model is developed to enable design-space exploration of RF circuits at cryogenic temperature and identify the temperature-dependent and temperature-invariant components of the extrinsic and the intrinsic FET. Finally, performance benchmarking reveals that 22 nm FDSOI cryogenic RF CMOS provides a viable option for achieving superior analog performance with giga-scale transistor integration density.

Más información

Título según WOS: ID WOS:000730529800005 Not found in local WOS DB
Título de la Revista: IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS
Volumen: 7
Número: 2
Editorial: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Fecha de publicación: 2021
Página de inicio: 184
Página final: 192
DOI:

10.1109/JXCDC.2021.3131144

Notas: ISI