Selective removal of copper (II) ions from aqueous solution using pyridyl-bridged mesoporous organosilica hybrid adsorbent

Thirupathi, Kokila; Rajesh, Subramani; Madhappan, Santhamoorthy; Gnanasekaran, Lalitha; Guganathan, Loganathan; Phan, Thi Tuong Vy; Kim, Seong-Cheol

Abstract

The incorporation of active functional groups into the mesoporous organosilica hybrid materials is efficient for various applications. A newly designed mesoporous organosilica adsorbent was prepared using diaminopyridyl groups bridged-(bis-trimethoxy)organosilane (DAPy) precursor by using Pluronic P123 as structure directing template via sol-gel co-condensation method. The hydrolysis reaction of DAPy precursor and tetraethyl orthosilacate (TEOS) with a DAPy content of about 20 mol% to TEOS were incorporated into the mesopore walls of the mesoporous organosilica hybrid nanoparticles (DAPy@MSA NPs). Low-angle XRD and FT-IR, N-2 adsorptiondesorption analysis, SEM, TEM, and TG analysis were used to characterize the synthesized DAPy@MSA NPs. The DAPy@MSA NPs exhibit an order mesoporous structure with a high surface area, mesopore size and pore volume of approximately similar to 465 m(2)/g, 4.4 nm and 0.48 cm(3)/g, respectively. The pyridyl groups integrated DAPy@MSA NPs showed the selective adsorption of Cu2+ ions from the aqueous medium by metal-ligand complex coordination of Cu2+ ions with the integrated pyridyl groups and the pendant hydroxyl (-OH) functional groups present into the mesopore walls of the DAPy@MSA NPs. In the presence of other competitive metal ions (Cr2+, Cd2+, Ni2+, Zn2+, and Fe2+), the DAPy@MSA NPs showed relatively high adsorption of Cu2+ ions (276 mg/g) from aqueous solution as compared to the other competitive metal ions at the same concentration (100 mg/L) of initial metal ion solution.

Más información

Título según WOS: Selective removal of copper (II) ions from aqueous solution using pyridyl-bridged mesoporous organosilica hybrid adsorbent
Título de la Revista: ENVIRONMENTAL RESEARCH
Volumen: 224
Editorial: ACADEMIC PRESS INC ELSEVIER SCIENCE
Fecha de publicación: 2023
DOI:

10.1016/j.envres.2023.115439

Notas: ISI