Abstract

This work presents the novel designed microchannel heat sink that combines the advantages of double-layer nested microchannels, impact jet structures and bifurcation (DNCI-MHS). Furtherly, the different working conditions based on the novel design (DNCI-MHS-WC1/2/3) are investigated by simulation methods and experimental verification. The parameters which can reflect the thermal-dynamic performance such as peak temperature on substrate, pressure drop penalty, Nusselt number and comprehensive heat transfer coefficient have been discussed in the work detailedly. In the numerical results, the maximum temperature difference on substrate of DNCI-MHS-WC2 is the best uniform compared with other models, which shows the lowest value equaling 1.12K. Besides, DNCI-MHS-WC2 has excellent heat dissipation performance, with a comprehensive heat transfer coefficient up to 1.355, which has been verified with experimental tests manufactured by SLM 3D printing technology. Moreover, both pressure drop penalty and Nusselt number have good agreements by simulations and experimental results. The results indicate that there is a best working condition based on the proposed design combined the features with double-layer nested microchannels, impact jet structures and bifurcation in enhancing the heat dissipation effect of microchannel heat sinks. The results of the present work can provide potential and effective solutions for the heat dissipation problem of high heat flux density electronic devices from both structural design and working condition analysis.