Experimental Evaluation of a Head-On Collision Warning System Fusing Machine Learning and Decentralized Radio Sensing

Cárdenas, JD; Diaz-Ibarra, MA; Contreras-Ponce, O; Gutierrez, CA; Aguilar-Ponce, R; Castillo-Soria, FR; Azurdia-Meza, CA

Keywords: sensors, feature extraction, roads, radar, trajectory, Doppler effect, Alarm systems, Deep learning (DL), doppler signatures, head-on vehicular collision, radio frequency (RF)

Abstract

This article presents the idea of an automatic head-on-collision warning system based on a decentralized radio sensing (RS) approach. In this framework, a vehicle in receiving mode employs a continuous waveform (CW) transmitted by a second vehicle as a probe signal to detect oncoming vehicles and warn the driver of a potential head-on collision. Such a CW can easily be incorporated as a pilot signal within the data frame of current multicarrier vehicular communication systems (VCSs). Detection of oncoming vehicles is performed by a machine learning (ML) module that analyzes the features of the Doppler signature imprinted on the CW probe signal by a rapidly approaching vehicle. This decentralized CW RS approach was assessed experimentally using data collected by a series of field trials conducted in three different two-lane vehicular scenarios: a high-speed highway, a rural road, and an urban road. Detection performance was evaluated for three different ML algorithms: a support vector machine radial basis function kernel, K-nearest neighbors, and boosted trees (BTs). The obtained results demonstrate the feasibility of the envisioned head-on-collision warning system based on the fusion of ML and decentralized CW RS. © 2001-2012 IEEE.

Más información

Título según WOS: Experimental Evaluation of a Head-On Collision Warning System Fusing Machine Learning and Decentralized Radio Sensing
Título según SCOPUS: Experimental Evaluation of a Head-On Collision Warning System Fusing Machine Learning and Decentralized Radio Sensing
Título de la Revista: IEEE Sensors Journal
Volumen: 24
Número: 13
Editorial: Institute of Electrical and Electronics Engineers Inc.
Fecha de publicación: 2024
Página de inicio: 21520
Página final: 21532
Idioma: English
DOI:

10.1109/JSEN.2024.3403492

Notas: ISI, SCOPUS